The Advantages To Using Reaction Injection Molding

Written by admin on March 8, 2019. Posted in Reaction injection molding process, Structural foam molding, Structural foam molding vs injection molding

What is the encapsulation molding process? Encapsulation molding process is a typically used process for encapsulating the chosen object in a composite material, like epoxy resin, and protect integrated circuitry, many tiny chips in your computer make use of it, or passive devices like resistors, inductors or capacitors. Encapsulation molding process is very popular in the semiconductor industry because of its ease at molding a robust array of inventions both tiny and large.

Integrated circuitry makes use of the encapsulation molding process by protecting it from dirt and debris as well as moisture. If you did not know, circuitry does not exactly play well with water. The story is the same for passive devices like resistors, capacitors and inductors. Each device needs a varying degree of encapsulated molding. For example, what do all the aforementioned passive devices have in c